MicroMolding Technology

Using the latest technology in machinery, tooling and automation, Trelleborg Sealing Solutions has the capability to manufacture micro components in high performance materials for critical semiconductor applications, including high precision wafer handling components such as end effector pads.

Our fully automated processing provides all the advantages needed for success in the semiconductor industry:

Precision - flashless, wasteless tool design concepts ensure high precision and quality
Purity - Fluoroelastomer and Perfluoroelastomer materials, including Isolast® PureFab™ Perfluoroelastomers (FFKM) for the highest levels of purity
Quality - quality is controlled in the process, not through extra control steps
Cost Effectiveness - Lowest Total Cost of Ownership (TCO)