Failure Analysis

Failure analysis determines the underlying causes of seal failure to help select a more effective solution for an application.

By examining a failed seal and its application, subsequent failures can be avoided. In semiconductor applications, seal failure can be caused by anything from loss of compression set to chemical degradation and plasma erosion.

Trelleborg Sealing Solutions supports customers with the analysis of the cause of failure and provides recommendations on more suitable materials or improved designs to reduce downtime and increase productivity.

Advantages of failure analysis:

• Reduces downtime
• Increases productivity
• By determining the options that fail, the optimum material, product or design is identified

Specialized Finite Element Analysis

Proving sealing system capabilities