Using the latest FEA techniques and software, Trelleborg Sealing Solutions accelerates time to market, optimizes quality of design and reduces overall costs of new and existing product designs.
Trelleborg Sealing Solutions combines FEA with world-class engineering resources to design, develop and manufacture leading-edge solutions for the semiconductor industry. By simulating the performance and behavior of a component within a semiconductor environment, rapid modifications and design iterations can be tested for viability virtually; a process that would take years with conventional methods.
When FEA methods are combined with engineering expertise and a portfolio of tried and tested materials and products, the optimal solution for an application can be determined, leading to increased performance and reduced downtime.
Advantages of using FEA in component development: